|
|
|
|
Technology List
|
Feature |
Condltlon |
Current |
2008 |
Plating Capability |
Aspect Ratio(Depth Diameter) |
Mechanical Through Hole |
15:01 |
20:01 |
|
Laser Blind via |
|
|
Solder Mask |
Minimum S/M Dam |
Minimum |
3mil |
3mil |
Minimum S/M Opening |
Minimum |
2mil |
1.5mil |
Surface Finish |
Organic Solderability Preservative(OSP) |
|
Yes |
Yes |
Electroless Nickel /Immersion Gold(ENIG) |
|
Yes |
Yes |
Selective OSP/ENIG |
|
Yes |
Yes |
Hot Air Solder Leverling (HASL) |
|
Yes |
Yes |
Immersion Silver |
|
Yes |
Yes |
Immersion Tin |
|
Yes |
Yes |
Carbon Ink |
|
Yes |
Yes |
Electric Test Capability
|
BGA pith |
Minimum |
16mil |
16mil |
Connector Pitch |
Minimum |
8mil |
8mil |
Pad Size |
|
8mil |
8mil |
Board thickness |
|
1 |
1.33 |
Cpk |
Dimension |
Etch feature to Etch feature |
1 |
1.33 |
Etch feature to Hole |
1 |
1.33 |
Hole to Hole |
1 |
1.33 |
Hole to Edge |
1 |
1.33 |
Edge to Edge |
1 |
1.33 |
Impedance |
|
1 |
1.33 |
Embedded Passive |
Embedded Capacitor |
Polymer Thick Film |
No |
Yes |
Flexible
Thin Film |
Normal DK |
No |
Yes |
High DK |
No |
Yes |
|
Embedded Resistor |
Polymer
Thick Film |
With Laser trim |
No |
No |
w/o Laser trim |
No |
Yes |
Metal Film |
250ohm/Sq&under |
No |
Yes |
500ohm/Sq&under |
No |
Yes |
|
|
|
|
|
|
|
<< 1 2 3 4 >>
|
|
| | |
