Technology List

Feature

Condltlon

Current

2008

Dielectric Thickness

Core thickness

Minimum

4mil

3mil

Dielectric Thickness(prepreg)

Minimum

2mil

2mil

IVH thickness

Minimum

3mil

2mil

Maximum

80mil

100mil

SBU thickness

Minimum

2mil

1.5mil

Maximum

5mil

5mil

Dimension

Tolerance

Board Thickness

THK<20mil

+/-2mil

+/-2mil

THK>20mil

+/-10%

+/-10%

BOW & Twist

THK<20mil

0.70%

0.70%

THK>20mil

0.70%

0.50%

Fiducial to Fiducial

+/-2mil

+/-1.5mil

Hole to Hole

+/-3mil

+/-3mil

Hole to Edge

+/-5mil

+/-5mil

Edge to Edge

+/-5mil

+/-5mil

Registration capability

Layer to layer

4mil

3mil

Hole wall to Conductor

7mil

6mil

Hole Formation

Mechanical Hole

Minimum

8mil

6mil

IVH Hole Size

Maximum

16mil

16mil

Lasor Hole Size

Minimumu

3mil

3mil

Maximum

8mil

8mil

Pad size (Mechanical Hole)

Inner Layer

Drill size+8mil

Drill size+8mil

Outer Layer

Drill size+8mil

Drill size+6mil

Inner Layer Clearance

Drill size+14mil

Drill size+12mil

Pad size(Laser Hole)

Drill size+8mil

Drill size+8mil

Hole Location Tolerance

+/-3mil

+/-3mil

Electrical/RF Capability

Min Line Widthy Spacing

Inner Layer(1/2 oz)

2/3mil

2/2mil

Inner Layer(1oz)

3/3mil

3/3mil

Outer Layer

3/4mil

3/3mil

Impedance Control

3mil Line width

10%

10%

4mil Line width

8%

8%

5mil Line width

5%

5%