Technology List

Feature

Condltlon

Current

2008

Structure

Layer Count

Maximum

30

30

Board Thickness

Minumum

14mil

14mil

Sequential Lamination

3xIVH

3xIVH

Sequential Build Up

3+N+3

Capped PTH

Yes

Yes

Via In Pad

Filled by Cu paste

Yes

Yes

Laser via filling

Filled by Cu paste

Yes

Yes

Cavity Formation

No

Yes

Hybrid

FR4+RCC

Yes

Yes

FR4+Aramid

Yes

Yes

FR4+Getek

Yes

Yes

FR4+Rogers

Yes

Yes

FR4+Rogers

Yes

Yes

FR4+PTFE

Yes

Yes

Rigid/Flex

Yes

Yes

Material

Base Material

FR4(Tg 140°C )

Yes

Yes

FR4(Tg 170°C )

Yes

Yes

Getek

Yes

Yes

BT

Yes

Yes

Low CTE

Yes

Yes

Low Dk.Df

Yes

Yes

PTFE

Yes

Yes

Rogers

Yes

Yes

Halogen Free

Yes

Yes

Lead Free

Yes

Yes

Kapton(Polyimide)

Yes

Yes

Build Up material

RCC

Yes

Yes

TCD

Yes

Yes

Aramid

Yes

Yes

FR4

Yes

Yes

Copper Foil(Outer layer)

Minumum

1/3 oz

1/8oz

Maximum

2oz

 8oz

Copper Foil(Inner layer)

Minumum

 1/2oz

1/3oz 

Maximum

2oz 

5oz